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TLE75602ESHXUMA1 - Infineon

Description: Power Switch ICs - Power Distribution SPIDER

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TLE75602ESHXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-TSDSO-24
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TLE75602ESHXUMA1 - Infineon  - 3D model - Small Outline Packages - PG-TSDSO-24
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TLE75602ESHXUMA1 Details

  • Manufacturer Part Number:

    TLE75602ESHXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    2A

  • Terminal Finish:

    Tin (Sn)

TLE75602ESHXUMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in the application note AN2018-01, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure reliable operation.
  • The input capacitor should be selected based on the input voltage, output current, and ripple current requirements. A general guideline is to choose a capacitor with a capacitance value of at least 10uF and a voltage rating of 1.5 to 2 times the input voltage. Additionally, the capacitor's ESR (Equivalent Series Resistance) should be low enough to minimize voltage ripple.
  • The TLE75602ESHXUMA1 is specified to operate from -40°C to 150°C, but the maximum ambient temperature range depends on the specific application and cooling conditions. In general, the device can operate up to 125°C ambient temperature with proper cooling, but this may require additional thermal design considerations.
  • To troubleshoot issues with the TLE75602ESHXUMA1, start by checking the input voltage, output current, and thermal conditions. Verify that the device is properly soldered and that the PCB layout follows the recommended guidelines. Use oscilloscopes and thermal imaging tools to monitor the device's behavior and identify potential issues. Consult the datasheet and application notes for specific troubleshooting guidelines.
  • Yes, the TLE75602ESHXUMA1 is designed to meet the requirements of high-reliability and safety-critical applications. It is AEC-Q100 qualified and meets the ISO 26262 functional safety standard. However, it is essential to follow the recommended design guidelines and perform thorough testing and validation to ensure the device meets the specific application requirements.

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