SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Qualification Status:
Not Qualified
Screening Level:
AEC-Q100
Seated Height-Max:
1.7 mm
Supply Voltage-Max:
5.5 V
Supply Voltage-Min:
4.5 V
Supply Voltage-Nom:
5 V
Surface Mount:
YES
Terminal Finish:
Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
Turn-off Time:
50 µs
Turn-on Time:
50 µs
Width:
3.9 mm
TLE8108EM Frequently Asked Questions (FAQs)
A good PCB layout for the TLE8108EM involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
The input capacitor should be a low-ESR ceramic capacitor with a value between 1uF to 10uF, while the output capacitor should be a low-ESR ceramic or film capacitor with a value between 10uF to 100uF. The capacitor values and types should be chosen based on the specific application requirements and operating conditions.
The TLE8108EM is rated for operation in an ambient temperature range of -40°C to +125°C. However, the device may be derated for operation at higher temperatures, and the maximum junction temperature should not exceed 150°C.
To ensure EMC with the TLE8108EM, follow proper PCB layout and design guidelines, use shielding and filtering where necessary, and ensure that the device is properly decoupled and bypassed. Additionally, follow the guidelines outlined in the relevant EMC standards, such as IEC 61000-4-x.
The recommended soldering profile for the TLE8108EM involves a peak temperature of 260°C, with a dwell time of 30-60 seconds above 217°C. The device should be soldered using a reflow soldering process, and the soldering profile should be optimized to minimize thermal stress on the device.
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TLE8108EM Overview
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