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TLE8250GVIOXUMA5 - Infineon

Description: INFINEON - TLE8250GVIOXUMA5 - CAN Bus, CAN, 4.5 V, 5.5 V, SOIC

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TLE8250GVIOXUMA5 - Infineon - PCB symbol
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TLE8250GVIOXUMA5 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-8 _
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TLE8250GVIOXUMA5 - Infineon - 3D model - Small Outline Packages - PG-DSO-8 _
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TLE8250GVIOXUMA5 Details

  • Manufacturer Part Number:

    TLE8250GVIOXUMA5

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    GREEN, PLASTIC PACKAGE-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    2A

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    4 mm

TLE8250GVIOXUMA5 Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a solid ground plane and a thermal via array under the device to ensure optimal thermal performance.
  • To ensure EMC, Infineon recommends following the guidelines in the application note AN2013-01, which provides information on PCB layout, component placement, and shielding.
  • Infineon recommends a soldering profile with a peak temperature of 260°C, a dwell time above 217°C of 60-90 seconds, and a cooling rate of 4-6°C/s.
  • Infineon recommends using a systematic approach to troubleshooting, including checking the power supply, signal integrity, and PCB layout, as well as using tools such as oscilloscopes and logic analyzers.
  • Infineon recommends handling the device by the body, avoiding touching the pins, and storing the device in a dry, cool place, away from direct sunlight and moisture.

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TLE8250GVIOXUMA5 Overview

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