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TLE94108ESXUMA1 - Infineon

Description: Eight half bridge power outputs • Very low power consumption in sleep mode • 3.3V / 5V compatible inputs with hysteresis • All outputs with overload and short circuit protection • Independently diagnosable outputs (overcurrent, open load) • Open load diagnostics in ON-state for all high-side and low-side • Outputs with selectable open load thresholds (HS1, HS2) • 16-bit Standard SPI interface with daisy chain and in-frame response capability for control and diagnosis • Fast diagnosis with the global

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TLE94108ESXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-TSDSO-24 package
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TLE94108ESXUMA1 - Infineon  - 3D model - Small Outline Packages - PG-TSDSO-24 package
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TLE94108ESXUMA1 Details

  • Manufacturer Part Number:

    TLE94108ESXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Analog IC - Other Type:

    HALF BRIDGE BRUSH DC MOTOR CONTROLLER

TLE94108ESXUMA1 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the TLE94108ESXUMA1 can be found in the Infineon application note AN2018-01, which provides guidelines for PCB design, component placement, and thermal management.
  • The TLE94108ESXUMA1 can be configured for low-power mode by setting the EN pin to logic low and the STBY pin to logic high. Additionally, the device can be put into sleep mode by setting the SLP pin to logic low.
  • The maximum current rating for the TLE94108ESXUMA1 is 1.5 A per channel, with a total current limit of 3 A for all channels combined.
  • Troubleshooting the TLE94108ESXUMA1 typically involves checking the device's power supply, clock signal, and input/output signals. Engineers can use oscilloscopes, logic analyzers, and other diagnostic tools to identify issues and debug the system.
  • The TLE94108ESXUMA1 has a maximum junction temperature of 150°C. To ensure reliable operation, engineers should ensure good thermal conductivity between the device and the PCB, and consider using thermal vias, heat sinks, or other thermal management techniques as needed.

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