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TLF35584QVVS2 - Infineon

Description: TLF35584QVVS2 is a multiple output system supply for safety-relevant applications supplying 3.3V-μC, transceivers, and sensors by an efficient and flexible pre-/post-regulator concept over a wide input voltage range

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PCB Footprints
TLF35584QVVS2 - Infineon PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - PG-VQFN-48_2020
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3D Models
TLF35584QVVS2 - Infineon  - 3D model - Quad Flat No-Lead - PG-VQFN-48_2020
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TLF35584QVVS2 Details

  • Manufacturer Part Number:

    TLF35584QVVS2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VQFN-48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    14

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    POWER SUPPLY MANAGEMENT CIRCUIT

  • JESD-30 Code:

    S-PQCC-N48

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCN

  • Package Equivalence Code:

    LCC48(UNSPEC)

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Screening Level:

    AEC-Q100

  • Supply Voltage-Max (Vsup):

    40 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

TLF35584QVVS2 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or a thermal shield to dissipate heat.
  • The recommended soldering conditions for the TLF35584QVVS2 are a peak temperature of 260°C, a soldering time of 10-30 seconds, and a soldering method that follows the IPC J-STD-020 standard.
  • To handle ESD protection, it's recommended to follow proper ESD handling procedures, use ESD-protective packaging, and implement ESD protection circuits in the design. The device itself has built-in ESD protection, but additional measures can provide extra protection.
  • Operating the device beyond the recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to operate the device within the specified operating conditions to ensure reliable operation.

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TLF35584QVVS2 Overview

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Part Image TLF35584QVVS2XUMA1 Infineon Technologies AG

Power Supply Management Circuit, Fixed, 1 Channel, PQCC48