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TLF50251ELXUMA2 - Infineon

Description: Switching Voltage Regulators

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TLF50251ELXUMA2 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-SSOP-14
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TLF50251ELXUMA2 - Infineon  - 3D model - Small Outline Packages - PG-SSOP-14
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TLF50251ELXUMA2 Details

  • Manufacturer Part Number:

    TLF50251ELXUMA2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Additional Feature:

    PFM CONTROL TECHNIQUE ALSO AVAILABLE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    45 V

  • Input Voltage-Min:

    4.75 V

  • Input Voltage-Nom:

    7 V

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.5 A

  • Output Voltage-Max:

    5.1 V

  • Output Voltage-Min:

    4.9 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSSOP

  • Package Equivalence Code:

    SSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.7 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2475 kHz

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

TLF50251ELXUMA2 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout for the TLF50251ELXUMA2 in the application note AN2014-01. It suggests using a thermal pad on the bottom side of the package, connected to a large copper area on the PCB to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using thermal interface materials, such as thermal pads or thermal grease, to improve heat transfer between the device and the heat sink or PCB.
  • Infineon recommends following the soldering conditions specified in the datasheet, which include a peak temperature of 260°C, a soldering time of 10 seconds, and a soldering method that meets the IPC J-STD-020 standard.
  • To troubleshoot issues with the overcurrent protection feature, check the device's datasheet for the expected behavior and fault detection mechanisms. Verify that the input voltage and current are within the recommended operating conditions, and ensure that the device is properly configured and connected. If issues persist, consult Infineon's application notes and technical support resources for further guidance.
  • When using the TLF50251ELXUMA2 in a high-reliability or safety-critical application, it's essential to follow Infineon's guidelines for functional safety and reliability. This includes performing thorough risk assessments, implementing redundant systems and error detection mechanisms, and ensuring compliance with relevant industry standards and regulations.

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TLF50251ELXUMA2 Overview

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