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TLIN10283DRBRQ1 - Texas Instruments

Description: LIN Transceivers Automotive local interconnect network (LIN) transceiver with integrated voltage regulator

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TLIN10283DRBRQ1 - Texas Instruments - PCB symbol
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PCB Footprints
TLIN10283DRBRQ1 - Texas Instruments PCB footprint - Small Outline No-lead - Small Outline No-lead - DRB0008J
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3D Models
TLIN10283DRBRQ1 - Texas Instruments - 3D model - Small Outline No-lead - DRB0008J
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TLIN10283DRBRQ1 Details

  • Manufacturer Part Number:

    TLIN10283DRBRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VSON-8

  • Country Of Origin:

    Mainland China, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2020-05-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Rate:

    100 Mbps

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SOP8(UNSPEC)

  • Package Shape:

    SQUARE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Supply Current-Max:

    135 mA

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

TLIN10283DRBRQ1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a common mode filter or a ferrite bead to reduce EMI.
  • Use a heat sink or a thermal pad to dissipate heat. Ensure good airflow around the device. Consider using a thermal interface material to improve heat transfer. Monitor the device's junction temperature to prevent overheating.
  • Use level shifters or voltage translators to ensure signal integrity between domains. Ensure that the device's power supply is decoupled from other voltage domains to prevent noise coupling.
  • Use an oscilloscope to analyze signal waveforms and identify issues. Check power supply voltage and current. Verify that the device is properly configured and that the PCB layout is correct. Consult the datasheet and application notes for troubleshooting guidelines.
  • Yes, but ensure that the PCB layout is optimized for high-speed signals. Use controlled impedance traces, and consider using a signal integrity analysis tool to simulate signal behavior.

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TLIN10283DRBRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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