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TLIN2029AMDRBRQ1 - Texas Instruments

Description: LIN Transceivers Fault protected local interconnect network (LIN) transceiver with dominant state timeout

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PCB Footprints
TLIN2029AMDRBRQ1 - Texas Instruments PCB footprint - Small Outline No-lead - Small Outline No-lead - DRB0008J _2021_2
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3D Models
TLIN2029AMDRBRQ1 - Texas Instruments  - 3D model - Small Outline No-lead - DRB0008J _2021_2
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TLIN2029AMDRBRQ1 Details

  • Manufacturer Part Number:

    TLIN2029AMDRBRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Rate:

    20 Mbps

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    5 mA

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    LIN TRANSCEIVER

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TLIN2029AMDRBRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good layout practices, such as keeping the input and output traces separate, using a solid ground plane, and minimizing parasitic inductance.
  • To ensure reliable operation, follow the recommended operating conditions, use a suitable thermal design, and consider the device's thermal characteristics. Additionally, ensure that the device is properly soldered and the PCB is designed to minimize thermal stress.
  • Operating the device outside the recommended input voltage range may affect its performance, efficiency, and reliability. Lower input voltages may reduce the output current, while higher input voltages may increase power dissipation and reduce the device's lifespan.
  • To troubleshoot issues, start by verifying the input voltage, output load, and PCB layout. Check for any signs of overheating, and ensure that the device is properly soldered. Use oscilloscopes and other diagnostic tools to identify the root cause of the issue, and consult the datasheet and application notes for guidance.
  • Yes, the TLIN2029AMDRBRQ1 is a high-frequency device, and proper EMI/EMC design considerations are essential. Follow good PCB layout practices, use shielding, and consider adding EMI filters or ferrite beads to minimize electromagnetic interference.

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TLIN2029AMDRBRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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