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TLP170J(TP,F) - Toshiba

Description: MOSFET Output Optocouplers Photorelay(MOS FET) ION=2.5A(max)

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TLP170J(TP,F) - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - 11-5H1
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3D Models
TLP170J(TP,F) - Toshiba  - 3D model - Small Outline Packages - 11-5H1
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TLP170J(TP,F) Details

  • Manufacturer Part Number:

    TLP170J(TP,F)

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-4

  • HTS Code:

    8541.40.95.00

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • Additional Feature:

    UL RECOGNIZED

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Control Current:

    0.002 A

  • Control Voltage:

    1 V

  • Forward Current-Max:

    0.025 A

  • Input Type:

    DC

  • Isolation Voltage-Max:

    1500 V

  • On-State Current-Max:

    0.07 A

  • On-state Resistance-Max:

    60 Ω

  • Operating Temperature-Max:

    65 °C

  • Operating Temperature-Min:

    -20 °C

  • Output Circuit Type:

    MOSFET

  • Overall Height:

    2.1 mm

  • Overall Length:

    4.4 mm

TLP170J(TP,F) Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the TLP170J is 4.5V to 5.5V.
  • To ensure reliability in high-temperature applications, it is recommended to follow the derating guidelines provided in the datasheet, and to consider using a heat sink or thermal management system to keep the junction temperature below 125°C.
  • The maximum current rating for the TLP170J is 1.5A, but it is recommended to operate within the recommended operating conditions to ensure reliability and prevent overheating.
  • To protect the TLP170J from ESD, it is recommended to follow proper handling and storage procedures, such as using anti-static bags or containers, and to use ESD protection devices such as diodes or resistors in the circuit design.
  • Yes, the TLP170J can be used in switching power supplies, but it is recommended to ensure that the device is operated within the recommended operating conditions and that the circuit design takes into account the device's switching characteristics and thermal management requirements.

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