TLP185(GRH-TL,SE footprint, schematic symbol and 3D model by Toshiba

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TLP185(GRH-TL,SE Details

The recommended soldering temperature is 260°C (500°F) and the recommended soldering time is 3 seconds or less to prevent damage to the device.
Handle the device by the body, not the leads, and store it in a dry, dark place to prevent damage from light, moisture, and mechanical stress.
The maximum allowable voltage for the TLP185 is 5V, exceeding this voltage may cause damage to the device.
Bias the TLP185 with a reverse voltage of 1-5V and a current of 10-100μA to ensure optimal performance and minimize dark current.
Use a land pattern with a minimum pad size of 0.5mm x 0.5mm and a spacing of 0.5mm between pads to ensure reliable soldering and minimize thermal resistance.

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