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TLP185(Y,SE(T - Toshiba

Description: Photocoupler, Tr, 2.3mm, DC, 4pin SO6

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PCB Footprints
TLP185(Y,SE(T - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - 11-4M1S_1
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3D Models
TLP185(Y,SE(T - Toshiba  - 3D model - Small Outline Packages - 11-4M1S_1
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TLP185(Y,SE(T Details

  • Manufacturer Part Number:

    TLP185(Y,SE(T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-6/4

  • HTS Code:

    8541.40.80.00

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    8

  • Additional Feature:

    UL APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    80 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    50%

  • Dark Current-Max:

    80 nA

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    3750 V

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.05 A

  • Operating Temperature-Max:

    110 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.000002 s

  • Surface Mount:

    YES

TLP185(Y,SE(T Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the TLP185 is 3.3V to 5V, although it can operate up to 7V with reduced performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking and ensuring good airflow around the device.
  • The maximum current rating for the TLP185 is 50mA per channel, although it's recommended to derate the current to 30mA per channel for reliable operation.
  • Yes, the TLP185 is suitable for high-speed data transmission applications up to 10Mbps, making it suitable for applications such as USB, UART, and I2C interfaces.
  • The TLP185 has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing to prevent damage to the device.

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TLP185(Y,SE(T Overview

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