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TLP2301(E(T - Toshiba

Description: Photo IC Output Photocoupler, Surface Mount, 4-Pin SO6

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TLP2301(E(T - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - 11-4M1S_2022
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TLP2301(E(T - Toshiba  - 3D model - Small Outline Packages - 11-4M1S_2022
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TLP2301(E(T Details

  • Manufacturer Part Number:

    TLP2301(E(T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-6/4

  • ECCN Code:

    3A001.a.2.c

  • HTS Code:

    8541.40.80.00

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    7.5

  • Additional Feature:

    UL RECOGNIZED

  • Configuration:

    SINGLE

  • Data Rate-Nom:

    0.02 MBps

  • Forward Current-Max:

    0.05 A

  • Isolation Voltage-Max:

    3750 V

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • Number of Functions:

    1

  • On-State Current-Max:

    0.05 A

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    LOGIC IC OUTPUT OPTOCOUPLER

  • Response Time-Max:

    0.00003 s

  • Response Time-Nom:

    0.000008 ns

  • Surface Mount:

    YES

TLP2301(E(T Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the TLP2301(E) is 4.5V to 5.5V.
  • To ensure reliable communication, use a common-mode choke coil or a ferrite bead to reduce electromagnetic interference (EMI) and radio-frequency interference (RFI). Additionally, use a shielded cable and ensure proper grounding.
  • The maximum cable length supported by the TLP2301(E) is 100 meters (328 feet) for a single segment, but this can be extended using repeaters or hubs.
  • To troubleshoot issues, check the power supply voltage, signal integrity, and cable connections. Use an oscilloscope to verify signal quality and check for errors in the transmission data.
  • The TLP2301(E) is compatible with other transceiver ICs that comply with the IEEE 802.3u Fast Ethernet standard, but compatibility should be verified through testing and validation.

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