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TLP251 - Toshiba

Description: Transistor Output Optocoupler, 1-Element, 2500V Isolation

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PCB Footprints
TLP251 - Toshiba PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 8-Pin DIP_2020
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3D Models
TLP251 - Toshiba  - 3D model - Dual-In-Line Packages - 8-Pin DIP_2020
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TLP251 Details

  • Manufacturer Part Number:

    TLP251

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    DIP-8

  • HTS Code:

    8541.40.80.00

  • Date Of Intro:

    1994-01-01

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    3

  • Additional Feature:

    UL RECOGNIZED

  • Configuration:

    COMPLEX

  • Data Rate-Nom:

    0.025 MBps

  • Forward Current-Max:

    0.02 A

  • Isolation Voltage-Max:

    2500 V

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Elements:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • Optoelectronic Device Type:

    LOGIC IC OUTPUT OPTOCOUPLER

  • Power Dissipation-Max:

    0.8 W

  • Response Time-Max:

    0.000001 s

  • Response Time-Nom:

    2.5e-7 ns

  • Supply Voltage-Min:

    10 V

  • Surface Mount:

    NO

TLP251 Frequently Asked Questions (FAQs)

  • The maximum allowable voltage that can be applied to the input pins is 5V. Exceeding this voltage can cause damage to the device.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the device's current and voltage ratings according to the temperature derating curve provided in the datasheet.
  • The recommended layout and spacing for the TLP251 on a PCB is to keep the input and output circuits separate and use a ground plane to minimize electromagnetic interference (EMI). A minimum spacing of 1.5 mm between the input and output pins is recommended.
  • Yes, the TLP251 can be used in high-frequency applications up to 1 MHz. However, the device's bandwidth and rise time may be affected at higher frequencies, and additional filtering or signal conditioning may be required.
  • To minimize EMI and RFI in systems using the TLP251, use shielding, filtering, and grounding techniques. Keep the input and output circuits separate, and use a common-mode choke or ferrite bead to filter out high-frequency noise.

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