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TLP387(TPL,E - Toshiba

Description: Transistor Output Optocouplers Photocoupler 300V .15A 5000Vrms

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TLP387(TPL,E - Toshiba PCB footprint - Other - Other - TLP387(TPL,E-4
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TLP387(TPL,E Details

  • Manufacturer Part Number:

    TLP387(TPL,E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    14 Weeks

  • Date Of Intro:

    2020-01-17

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    7.5

  • Additional Feature:

    UL RECOGNIZED

  • Coll-Emtr Bkdn Voltage-Min:

    300 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE AND RESISTOR

  • Current Transfer Ratio-Min:

    1000%

  • Current Transfer Ratio-Nom:

    4000%

  • Dark Current-Max:

    200 nA

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    5000 V

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.15 A

  • Operating Temperature-Max:

    110 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    DARLINGTON OUTPUT OPTOCOUPLER

  • Packing Method:

    TAPE

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.00004 s

  • Surface Mount:

    YES

TLP387(TPL,E Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the TLP387 is 4.5V to 5.5V.
  • To ensure proper power-on and power-off, the VCC pin should be ramped up and down slowly (typically 10ms or more) to prevent latch-up or other issues.
  • The maximum current rating for the TLP387's output pins is 15mA per pin, with a total current limit of 100mA for all output pins combined.
  • The TLP387 has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures when handling the device, such as using an ESD wrist strap or mat.
  • The TLP387 is rated for operation up to 85°C, but it's recommended to derate the device's performance and consider thermal management strategies for high-temperature applications.

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