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TLP624(F) - Toshiba

Description: Toshiba, TLP624(F) DC Input Transistor Output Optocoupler, Through Hole, 4-Pin PDIP

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TLP624(F) - Toshiba - PCB symbol
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PCB Footprints
TLP624(F) - Toshiba PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 11-5B2S_2021
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3D Models
TLP624(F) - Toshiba - 3D model - Dual-In-Line Packages - 11-5B2S_2021
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TLP624(F) Details

  • Manufacturer Part Number:

    TLP624(F)

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • HTS Code:

    8541.40.80.00

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    0

  • Additional Feature:

    UL RECOGNIZED

  • Coll-Emtr Bkdn Voltage-Min:

    55 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    50%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.02 A

  • Forward Voltage-Max:

    1.3 V

  • Isolation Voltage-Max:

    5000 V

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.05 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Power Dissipation-Max:

    0.25 W

  • Response Time-Max:

    0.000008 s

  • Surface Mount:

    NO

TLP624(F) Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the TLP624(F) is 3.3V to 5V, although it can operate from 2.7V to 5.5V.
  • To ensure proper biasing, connect the VCC pin to a stable voltage source, and decouple it with a 0.1uF capacitor to ground. Also, ensure the input voltage is within the recommended range.
  • The TLP624(F) can sink or source up to 50mA of current, but it's recommended to limit the current to 20mA for reliable operation.
  • The TLP624(F) has a thermal shutdown protection feature. Ensure good thermal design practices, such as providing adequate heat sinking and airflow, to prevent overheating.
  • Yes, the TLP624(F) is suitable for high-speed applications up to 100Mbps. However, ensure proper PCB layout and signal integrity to minimize signal degradation.

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TLP624(F) Overview

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