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TLP781(BL,F) - Toshiba

Description: Toshiba, TLP781(BL,F) DC Input Phototransistor Output Optocoupler, Through Hole, 4-Pin PDIP

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TLP781(BL,F) - Toshiba - PCB symbol
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PCB Footprints
TLP781(BL,F) - Toshiba PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - TLP781
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3D Models
TLP781(BL,F) - Toshiba - 3D model - Dual-In-Line Packages - TLP781
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TLP781(BL,F) Details

  • Manufacturer Part Number:

    TLP781(BL,F)

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • HTS Code:

    8541.40.80.00

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    0

  • Additional Feature:

    UL RECOGNIZED

  • Coll-Emtr Bkdn Voltage-Min:

    80 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    200%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.025 A

  • Forward Voltage-Max:

    1.3 V

  • Isolation Voltage-Max:

    5000 V

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.05 A

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.000002 s

  • Surface Mount:

    NO

TLP781(BL,F) Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the TLP781 is -40°C to 125°C.
  • To ensure reliability, it's essential to follow proper thermal design and layout guidelines, including providing adequate heat sinking and minimizing thermal resistance.
  • The maximum allowable power dissipation for the TLP781 is 1.5W, and it's essential to ensure that the device does not exceed this rating to prevent overheating and damage.
  • Yes, the TLP781 is suitable for high-frequency applications up to 100 kHz, but it's essential to consider the device's switching characteristics and ensure that the application meets the recommended operating conditions.
  • To prevent electrostatic discharge (ESD) damage, it's essential to follow proper handling and storage procedures, including using ESD-protective packaging and equipment, and ensuring that all personnel handling the device are properly grounded.

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TLP781(BL,F) Overview

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