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TLP785F(GR-LF7,F(C - Toshiba

Description: Optocoupler Transistor 100-300 DIP4LF7

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TLP785F(GR-LF7,F(C - Toshiba PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - dip-4
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TLP785F(GR-LF7,F(C - Toshiba  - 3D model - Dual-In-Line Packages - dip-4
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TLP785F(GR-LF7,F(C Details

  • Manufacturer Part Number:

    TLP785F(GR-LF7,F(C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DIP-4

  • Reach Compliance Code:

    Unknown

  • HTS Code:

    8541.40.80.00

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6

  • Additional Feature:

    UL APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    80 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    100%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.025 A

  • Forward Voltage-Max:

    1.3 V

  • Isolation Voltage-Max:

    5000 V

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.05 A

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.000002 s

  • Surface Mount:

    YES

TLP785F(GR-LF7,F(C Frequently Asked Questions (FAQs)

  • A good PCB layout for the TLP785F should consider the following: keep the input and output traces short and wide, use a solid ground plane, and place the device close to the power source. Additionally, ensure that the input and output capacitors are placed as close to the device as possible.
  • To ensure the device operates within the recommended operating conditions, make sure to follow the recommended voltage and current ratings, and keep the device within the specified temperature range (-40°C to 125°C). Also, ensure that the device is not exposed to excessive moisture or humidity.
  • The TLP785F has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to dissipate heat efficiently. Additionally, ensure good airflow around the device and consider using a heat sink if the device is expected to operate at high temperatures.
  • To troubleshoot issues with the TLP785F, start by checking the input voltage and current, and ensure that the device is properly connected to the PCB. Check for any signs of overheating, and verify that the device is operating within the recommended temperature range. If issues persist, consult the datasheet and application notes for further guidance.
  • The TLP785F has built-in ESD protection, but it's still important to follow proper ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.

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TLP785F(GR-LF7,F(C Overview

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