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TLR2B10DR007FTDG - TE Connectivity

Description: Configuration Features: Number of Resistors 1 | Dimensions: Product Width .063 INCH | Product Length .126 INCH | Product Height .6 MM | Product Length 3.2 MM | Product Height .024 INCH | Product Width 1.6 MM | Electrical Characteristics: Resistance Value .007 OHM | Passive Component Tolerance 1 PCT | Resistance Class Up to 1kΩ | Power Rating 1 WATT | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: Resistor Type Current Sensing Resistor | Package Size Code 1206 | Element Type Me

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PCB Footprints
TLR2B10DR007FTDG - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - TLR2B_2022
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3D Models
TLR2B10DR007FTDG - TE Connectivity  - 3D model - Resistor Chip - TLR2B_2022
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TLR2B10DR007FTDG Details

  • Manufacturer Part Number:

    TLR2B10DR007FTDG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    15 Weeks, 3 Days

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    7.8

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    170 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR

  • Physical Dimension:

    3.2mm x 1.6mm x .6mm

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    70 °C

  • Resistance:

    0.007 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL STRIP

  • Temperature Coefficient:

    50 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    2.6458 V

TLR2B10DR007FTDG Frequently Asked Questions (FAQs)

  • TE Connectivity provides a recommended PCB layout and land pattern in their application notes or design guides. It's essential to follow these guidelines to ensure proper soldering and to prevent thermal and mechanical stress on the component.
  • The datasheet provides thermal resistance and power dissipation information. However, it's crucial to consider the component's thermal interface material, PCB thermal conductivity, and airflow in the system to ensure effective heat dissipation. Consult with thermal management experts or use thermal simulation tools to optimize your design.
  • Yes, TE Connectivity provides soldering and rework guidelines in their application notes or manufacturing guides. It's essential to follow these guidelines to prevent damage to the component and ensure reliable connections. Additionally, consider using a soldering iron with a controlled temperature and a suitable solder alloy.
  • While the datasheet provides some information on the component's mechanical characteristics, it's essential to consult with TE Connectivity or a qualified engineer to determine the component's suitability for high-vibration or high-shock environments. Additional testing or analysis may be required to ensure the component's reliability in such conditions.
  • Implement a robust quality control process, including inspection, testing, and validation of the component's electrical and mechanical characteristics. Ensure that your production process follows TE Connectivity's recommended guidelines, and consider implementing a First Article Inspection (FAI) or Production Part Approval Process (PPAP) to verify the component's quality and reliability.

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TLR2B10DR007FTDG Overview

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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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