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TLRP2B10DR015FTD - TE Connectivity

Description: .015 ohm, Metal Strip, Current Sensing Resistor, 1 %, 1206, 1 W, ±50 ppm/°C, Solder, 2 Terminations, .55 mm [.022 in] Height, CGS TLRP

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TLRP2B10DR015FTD - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - 1206 (3216 Metric)_2025-1
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3D Models
TLRP2B10DR015FTD - TE Connectivity  - 3D model - Resistor Chip - 1206 (3216 Metric)_2025-1
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TLRP2B10DR015FTD Details

  • Manufacturer Part Number:

    TLRP2B10DR015FTD

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks, 3 Days

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    7.8

  • Additional Feature:

    ANTI-SULFUR

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    170 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.15 mm

  • Package Style:

    SMT

  • Package Width:

    1.45 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Physical Dimension:

    3.1mm x 1.55mm x .55mm

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    0.015 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL STRIP

  • Temperature Coefficient:

    50 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    0.1225 V

TLRP2B10DR015FTD Frequently Asked Questions (FAQs)

  • TE Connectivity provides a recommended PCB layout and land pattern in their application notes or design guides, which can be found on their website or through their customer support. It's essential to follow these guidelines to ensure proper assembly and performance of the component.
  • The thermal management of TLRP2B10DR015FTD is critical to ensure its reliability and performance. Engineers should consider the thermal resistance of the component, PCB material, and surrounding environment. They can use thermal interface materials, heat sinks, or other cooling solutions to manage the temperature. TE Connectivity may also provide thermal management guidelines in their application notes or datasheet.
  • While the datasheet provides the recommended operating temperature range, engineers may want to know the absolute maximum temperature range for the component. According to TE Connectivity's documentation, the maximum operating temperature range for TLRP2B10DR015FTD is typically -55°C to 150°C, but this may vary depending on the specific application and environment.
  • TLRP2B10DR015FTD is designed to meet certain vibration and shock requirements, but engineers should consult TE Connectivity's documentation or contact their customer support to determine the component's suitability for their specific application. Additional testing or validation may be required to ensure the component's reliability in high-vibration or high-shock environments.
  • To ensure the reliability and quality of TLRP2B10DR015FTD, engineers should follow TE Connectivity's recommended design guidelines, use proper PCB assembly and soldering techniques, and perform thorough testing and validation of their design. They should also consider factors such as component handling, storage, and moisture sensitivity.

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TLRP2B10DR015FTD Overview

Use the download button to access the TLRP2B10DR015FTD schematic symbol, PCB footprint, and 3D model.
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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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