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TLRP2B10ER015FTD - TE Connectivity

Description: Configuration Features: Number of Resistors 1 | Dimensions: Product Length .124 INCH | Product Length 3.15 MM | Product Width 1.45 MM | Product Height .55 MM | Product Width .057 INCH | Product Height .022 INCH | Electrical Characteristics: Resistance Class Up to 1kΩ | Resistance Value .015 OHM | Passive Component Tolerance 1 PCT | Power Rating 1 WATT | Packaging Features: Packaging Method Tape & Reel | Product Type Features: Element Type Metal Strip | Package Size Code 1206 | Resistor Type Current Sensing

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PCB Footprints
TLRP2B10ER015FTD - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - 3.15mm x 1.45mm_2025-1.1
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3D Models
TLRP2B10ER015FTD - TE Connectivity  - 3D model - Resistor Chip - 3.15mm x 1.45mm_2025-1.1
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TLRP2B10ER015FTD Details

  • Manufacturer Part Number:

    TLRP2B10ER015FTD

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks, 3 Days

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    7.6

  • Additional Feature:

    ANTI-SULFUR

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    170 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.15 mm

  • Package Style:

    SMT

  • Package Width:

    1.45 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Physical Dimension:

    3.1mm x 1.55mm x .55mm

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    0.015 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL STRIP

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    0.1225 V

TLRP2B10ER015FTD Frequently Asked Questions (FAQs)

  • TE Connectivity provides a recommended PCB layout and land pattern in their application notes or design guides, which can be found on their website or through their customer support. It's essential to follow these guidelines to ensure proper assembly and reliability.
  • The thermal management of TLRP2B10ER015FTD is critical. Ensure good airflow around the component, and consider using thermal vias or thermal pads on the PCB to dissipate heat. The datasheet provides thermal resistance values, which can help with thermal design and simulation.
  • While the datasheet provides a recommended operating temperature range, it's essential to note that the maximum operating temperature range may be derated based on the specific application and environmental conditions. Consult with TE Connectivity's technical support or application notes for more information.
  • While the TLRP2B10ER015FTD is designed to be reliable, it's crucial to evaluate its performance in high-vibration or high-shock environments. TE Connectivity provides vibration and shock testing data, and it's recommended to consult with their technical support to determine the component's suitability for such applications.
  • To ensure reliability and longevity, follow proper assembly and handling procedures, and ensure the component is operated within its recommended specifications. Regularly inspect the component for signs of wear or damage, and consider implementing redundancy or fail-safe mechanisms in critical applications.

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TLRP2B10ER015FTD Overview

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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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