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TLS810D1EJV33XUMA1 - Infineon

Description: LDO Voltage Regulators OPTIREG LINEAR

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TLS810D1EJV33XUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO8-EP
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TLS810D1EJV33XUMA1 - Infineon  - 3D model - Small Outline Packages - PG-DSO8-EP
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TLS810D1EJV33XUMA1 Details

  • Manufacturer Part Number:

    TLS810D1EJV33XUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DSO-8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.65 V

  • Dropout Voltage1-Nom:

    0.25 V

  • Input Voltage Absolute-Max:

    45 V

  • Input Voltage-Max:

    42 V

  • Input Voltage-Min:

    3.95 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Line Regulation-Max:

    0.02%

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.1 A

  • Output Voltage1-Max:

    3.37 V

  • Output Voltage1-Min:

    3.23 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.7 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    2.12%

  • Width:

    3.9 mm

TLS810D1EJV33XUMA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • To ensure EMC, use a shielded cable for the output, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the input lines. Additionally, follow the recommended PCB layout and grounding scheme.
  • The maximum allowed voltage deviation on the input pins is ±10% of the nominal input voltage. Exceeding this limit may affect the device's performance or even cause damage.
  • To troubleshoot output voltage regulation issues, check the input voltage, output load, and PCB layout. Verify that the device is properly soldered and that there are no shorts or opens on the PCB. Use an oscilloscope to measure the output voltage and check for any oscillations or noise.
  • A low-ESR ceramic capacitor with a value of 10-22 μF is recommended for the input pin. This helps to filter out noise and ensure stable operation.

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TLS810D1EJV33XUMA1 Overview

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