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TLS850B0TEV50ATMA1 - Infineon

Description: INFINEON - TLS850B0TEV50ATMA1 - LDO, AEC-Q100, FIXED, 5V, 0.5A, TO-252-5

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PCB Footprints
TLS850B0TEV50ATMA1 - Infineon PCB footprint - Other - Other - PG-TO252-5-11_FFW
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3D Models
TLS850B0TEV50ATMA1 - Infineon  - 3D model - Other - PG-TO252-5-11_FFW
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TLS850B0TEV50ATMA1 Details

  • Manufacturer Part Number:

    TLS850B0TEV50ATMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-252, 5/4 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6.7

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.5 V

  • Dropout Voltage1-Nom:

    0.25 V

  • Input Voltage Absolute-Max:

    45 V

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    5.5 V

  • JESD-30 Code:

    R-PSSO-G4

  • Length:

    6.5 mm

  • Line Regulation-Max:

    0.01%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.5 A

  • Output Voltage1-Max:

    5.1 V

  • Output Voltage1-Min:

    4.9 V

  • Output Voltage1-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-252

  • Package Equivalence Code:

    SMSIP5H,.37,50TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.5 mm

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.14 mm

  • Terminal Position:

    SINGLE

  • Voltage Tolerance-Max:

    2%

  • Width:

    6.22 mm

TLS850B0TEV50ATMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to ensure optimal thermal performance. A minimum of 5 thermal vias with a diameter of 0.3 mm is recommended.
  • To ensure EMC, Infineon recommends following the guidelines in the IEC 61967 standard. Additionally, a shielded cable and a common-mode choke can be used to reduce electromagnetic interference (EMI).
  • Infineon recommends a soldering profile with a peak temperature of 260°C, a dwell time above 217°C of 60-90 seconds, and a cooling rate of 4-6°C/s.
  • Infineon recommends storing the device in its original packaging, away from direct sunlight and moisture. The device should be handled with anti-static precautions, and electrostatic discharge (ESD) protection should be used during shipping.
  • The TLS850B0TEV50ATMA1 is manufactured according to Infineon's quality standards, which include ISO/TS 16949 and ISO 9001. The device is also qualified according to AEC-Q100 and is PPAP capable.

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TLS850B0TEV50ATMA1 Overview

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