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TLV1702AIRUGR - Texas Instruments

Description: Dual, 2.2-V to 36-V, microPower Comparator

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PCB Footprints
TLV1702AIRUGR - Texas Instruments PCB footprint - Other - Other - RUG0008A
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3D Models
TLV1702AIRUGR - Texas Instruments  - 3D model - Other - RUG0008A
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TLV1702AIRUGR Details

  • Manufacturer Part Number:

    TLV1702AIRUGR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    20 µA

  • Bias Current-Max (IIB) @25C:

    0.015 µA

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    S-PQCC-N8

  • JESD-609 Code:

    e4

  • Length:

    1.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    OPEN-COLLECTOR; OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Response Time-Nom:

    560 ns

  • Seated Height-Max:

    0.4 mm

  • Subcategory:

    Comparator

  • Supply Current-Max:

    0.15 mA

  • Supply Voltage Limit-Max:

    40 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.5 mm

TLV1702AIRUGR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TLV1702AIRUGR involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog ground plane to reduce noise and crosstalk.
  • The gain resistor values for the TLV1702AIRUGR depend on the desired gain and bandwidth of the amplifier. A good starting point is to use the gain resistor calculator tool provided by Texas Instruments or to consult the application notes and design guides. It's also important to consider the trade-off between gain and bandwidth when selecting the resistor values.
  • The maximum power dissipation of the TLV1702AIRUGR is 1.4W. To ensure it doesn't overheat, it's essential to provide adequate heat sinking, such as a thermal pad or a heat sink, and to keep the device in a well-ventilated area. Additionally, it's recommended to follow the thermal design guidelines provided by Texas Instruments and to monitor the device's temperature during operation.
  • The TLV1702AIRUGR is rated for operation up to 125°C, but its performance may degrade at higher temperatures. It's essential to consider the device's temperature coefficient and to ensure that the device is properly heat-sunk to prevent overheating. Additionally, it's recommended to consult the device's datasheet and application notes for specific guidance on high-temperature operation.
  • To filter out noise and interference when using the TLV1702AIRUGR, it's recommended to use a combination of passive and active filtering techniques. This may include adding capacitors to filter out high-frequency noise, using a ferrite bead to filter out electromagnetic interference, and implementing a low-pass filter to remove high-frequency components. Additionally, it's essential to follow proper PCB layout and grounding techniques to minimize noise and interference.

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TLV1702AIRUGR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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