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TLV1812DDFR - Texas Instruments

Description: Analog Comparators 40V 5UA DUAL COMPARATOR

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PCB Footprints
TLV1812DDFR - Texas Instruments PCB footprint - SOT23 (8-Pin) - SOT23 (8-Pin) - TLV1812DDFR*
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3D Models
TLV1812DDFR - Texas Instruments  - 3D model - SOT23 (8-Pin) - TLV1812DDFR*
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TLV1812DDFR Details

  • Manufacturer Part Number:

    TLV1812DDFR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.0012 µA

  • Bias Current-Max (IIB) @25C:

    0.0012 µA

  • Input Offset Voltage-Max:

    4000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    PUSH-PULL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP8,.11,25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Response Time-Nom:

    900 ns

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.02 mA

  • Supply Voltage Limit-Max:

    42 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.6 mm

TLV1812DDFR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow general best practices for op-amp layout, such as keeping the input and output traces short and separate, and using a solid ground plane to reduce noise and EMI.
  • The choice of resistors for the feedback network depends on the desired gain and bandwidth of the amplifier. A good starting point is to use resistors with a 1% or 0.1% tolerance, and to choose values that minimize noise and maximize bandwidth. The datasheet provides some guidance on resistor selection, but it's also recommended to consult op-amp design guides and application notes for more detailed information.
  • The maximum power dissipation of the TLV1812DDFR is not explicitly stated in the datasheet, but it can be calculated based on the package thermal resistance and the maximum junction temperature. According to the datasheet, the package thermal resistance is 54.3°C/W, and the maximum junction temperature is 150°C. Assuming a maximum ambient temperature of 85°C, the maximum power dissipation would be approximately 1.3W.
  • Yes, the TLV1812DDFR can be used as a unity-gain buffer, but it's not the most ideal choice. The device has a relatively high input bias current, which can cause output voltage errors in unity-gain configurations. Additionally, the device has a limited output current drive capability, which may not be sufficient for some applications. A better choice for a unity-gain buffer would be an op-amp with lower input bias current and higher output current drive capability.
  • The TLV1812DDFR has built-in ESD protection, but it's still recommended to take precautions to prevent ESD damage during handling and assembly. Additionally, the device can be protected from overvoltage by using external voltage clamps or transient voltage suppressors. It's also recommended to follow proper PCB design and layout practices to minimize the risk of ESD and overvoltage damage.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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