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TLV2217-33KVURG3 - Texas Instruments

Description: Low-Dropout Fixed-Voltage Regulators

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TLV2217-33KVURG3 - Texas Instruments PCB footprint - Other - Other - KVU0003A
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TLV2217-33KVURG3 - Texas Instruments  - 3D model - Other - KVU0003A
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TLV2217-33KVURG3 Details

  • Manufacturer Part Number:

    TLV2217-33KVURG3

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MODULE

  • Pin Count:

    2

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.5 V

  • Dropout Voltage1-Nom:

    0.5 V

  • Input Voltage Absolute-Max:

    16 V

  • Input Voltage-Max:

    12 V

  • Input Voltage-Min:

    3 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Length:

    6.6 mm

  • Line Regulation-Max:

    0.015%

  • Load Regulation-Max:

    0.03%

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature-Max:

    125 °C

  • Output Current1-Max:

    0.5 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-252

  • Package Equivalence Code:

    SMSIP3H,.38,90TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    2.52 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.29 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    6.095 mm

TLV2217-33KVURG3 Frequently Asked Questions (FAQs)

  • A good PCB layout for the TLV2217-33KVURG3 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce noise and inductance. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure the TLV2217-33KVURG3 operates within its SOA, calculate the device's power dissipation using the formula Pd = (Vin - Vout) x Iout. Ensure the calculated power dissipation is within the specified SOA, and provide adequate heat sinking and thermal management to prevent overheating.
  • The TLV2217-33KVURG3 is rated for operation up to 125°C. In high-temperature environments, ensure the device is properly heat-sunk, and consider derating the output current to prevent overheating. Also, ensure the input and output capacitors are rated for high temperatures and can handle the increased stress.
  • To troubleshoot issues with the TLV2217-33KVURG3, start by verifying the input voltage, output voltage, and output current are within the specified ranges. Check the PCB layout for noise and oscillation issues, and ensure the input and output capacitors are properly selected and placed. Use an oscilloscope to observe the output voltage and current waveforms to identify any anomalies.
  • Yes, the TLV2217-33KVURG3 can be used in a parallel configuration to increase the output current. To do so, connect multiple devices in parallel, ensuring the output voltages are matched and the input capacitors are properly sized. However, be aware that paralleling devices can increase the risk of oscillations and noise, so proper PCB layout and decoupling are crucial.

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TLV2217-33KVURG3 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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