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TLV2221CDBVT - Texas Instruments

Description: Texas Instruments TLV2221CDBVT Op Amp, 0.51MHz CMOS, Rail to Rail, 3 → 9 V, 5-Pin SOT-23

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PCB Footprints
TLV2221CDBVT - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005_
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3D Models
TLV2221CDBVT - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005_
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TLV2221CDBVT Details

  • Manufacturer Part Number:

    TLV2221CDBVT

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00015 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    83 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00015 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Min:

    0.05 V/us

  • Slew Rate-Nom:

    0.18 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.075 mA

  • Supply Voltage Limit-Max:

    12 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    510

  • Voltage Gain-Min:

    3000

  • Wideband:

    NO

  • Width:

    1.6 mm

TLV2221CDBVT Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TLV2221CDBVT is 670 mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • Yes, the TLV2221CDBVT is rated for operation from -40°C to 125°C, making it suitable for high-temperature applications. However, the device's performance may degrade at higher temperatures, and the maximum junction temperature (TJ) should not exceed 150°C.
  • To ensure stability, follow proper PCB layout practices, use a low-ESR capacitor (e.g., ceramic or film capacitor) for decoupling, and avoid parasitic inductance in the feedback loop. Additionally, consider adding a small capacitor (e.g., 10-100 pF) in parallel with the feedback resistor to improve stability.
  • Keep the input and output traces short and separate, avoid crossing signal traces, and use a solid ground plane to minimize noise and parasitic inductance. Place decoupling capacitors close to the device's power pins, and use a low-impedance path for the feedback loop.
  • While the TLV2221CDBVT can be used as a comparator, it's not the most suitable device for this application. The device's output stage is optimized for linear operation, and its response time may be slower than a dedicated comparator. Consider using a dedicated comparator IC for comparator applications.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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