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TLV2231IDBVT - Texas Instruments

Description: Texas Instruments TLV2231IDBVT Op Amp, 2MHz CMOS, Rail to Rail, 3 → 9 V, 5-Pin SOT-23

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PCB Footprints
TLV2231IDBVT - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV--+---1_
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3D Models
TLV2231IDBVT - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV--+---1_
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TLV2231IDBVT Details

  • Manufacturer Part Number:

    TLV2231IDBVT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23

  • Package Description:

    GREEN, SOT-23, 5 PIN

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00015 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    70 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Min:

    0.5 V/us

  • Slew Rate-Nom:

    1.6 V/us

  • Supply Current-Max:

    1.3 mA

  • Supply Voltage Limit-Max:

    12 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2000

  • Voltage Gain-Min:

    300

  • Wideband:

    NO

  • Width:

    1.6 mm

TLV2231IDBVT Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TLV2231IDBVT is 670mW, which is calculated based on the maximum junction temperature and thermal resistance.
  • To ensure stability, add a capacitor (typically 10-100pF) between the output and the inverting input to compensate for the op-amp's internal capacitance and prevent oscillations.
  • Keep the input and output traces short and away from noise sources, use a ground plane, and decouple the power supply with a 0.1uF capacitor to minimize noise and EMI.
  • While the TLV2231IDBVT can be used as a comparator, it's not recommended due to its op-amp architecture and limited slew rate. A dedicated comparator like the TLV7031 is a better choice for comparator applications.
  • Use ESD protection devices like TVS diodes or ESD arrays on the input and output pins to protect the TLV2231IDBVT from electrostatic discharge.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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