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TLV2241IDBVR - Texas Instruments

Description: Single Micropower, 2.5-V, RRIO, Single Supply Amplifier

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PCB Footprints
TLV2241IDBVR - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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3D Models
TLV2241IDBVR - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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TLV2241IDBVR Details

  • Manufacturer Part Number:

    TLV2241IDBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • Country Of Origin:

    Mainland China, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.001 µA

  • Bias Current-Max (IIB) @25C:

    0.0005 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00025 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.3 mm

  • Slew Rate-Nom:

    0.002 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.00125 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    5.5

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    1.65 mm

TLV2241IDBVR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TLV2241IDBVR involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a star-ground configuration and to avoid routing digital signals near the analog inputs.
  • To ensure the TLV2241IDBVR operates within its recommended operating conditions, verify that the supply voltage is within the specified range (2.7V to 16V), the operating temperature is within the specified range (-40°C to 125°C), and the input signals are within the specified voltage range (0V to VCC).
  • The recommended input impedance for the TLV2241IDBVR is in the range of 1kΩ to 10kΩ. A higher input impedance can lead to increased noise and distortion, while a lower input impedance can cause signal attenuation. It's essential to match the input impedance to the amplifier's input impedance to ensure optimal performance.
  • To handle ESD protection for the TLV2241IDBVR, use ESD protection devices such as TVS diodes or ESD protection arrays on the input lines. Failure to provide adequate ESD protection can result in device damage or failure, leading to reduced reliability and lifespan.
  • The TLV2241IDBVR has a thermal pad that must be connected to a solid ground plane to ensure proper heat dissipation. Additionally, ensure that the device is mounted on a PCB with adequate thermal conductivity, and consider using thermal vias or heat sinks if the device is expected to operate at high temperatures or with high power dissipation.

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TLV2241IDBVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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