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TLV2254AID - Texas Instruments

Description: TLV2254AID, Quad Operational Amplifier 0.2MHz CMOS, R-R, 3, 5V, 14-Pin SOIC

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TLV2254AID - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G14)
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TLV2254AID - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G14)
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TLV2254AID Details

  • Manufacturer Part Number:

    TLV2254AID

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    14

  • Country Of Origin:

    Malaysia, Mexico, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.001 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    83 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    850 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.05 V/us

  • Slew Rate-Nom:

    0.12 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.25 mA

  • Supply Voltage Limit-Max:

    16 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    200

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3.9 mm

TLV2254AID Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TLV2254AID is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability, it's essential to follow proper PCB layout practices, such as minimizing parasitic capacitance and inductance, using a solid ground plane, and placing bypass capacitors close to the device. Additionally, the datasheet recommends a minimum gain of 5 for stable operation.
  • The recommended decoupling capacitor value is 0.1μF to 1μF, depending on the specific application and noise requirements. A larger capacitor value can help reduce noise and improve PSRR.
  • While the TLV2254AID can be used as a comparator, it's not the most suitable device for this application. The device is optimized for linear operation, and its performance as a comparator may not be as good as a dedicated comparator IC. If you need a comparator, consider using a dedicated comparator IC like the TLV7031.
  • The input impedance of the TLV2254AID is typically around 10^12 ohms in parallel with a few pF of capacitance. You can calculate the input impedance using the equation: Zin = (Rin * Cin) / (Rin + Cin), where Rin is the input resistance and Cin is the input capacitance.

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TLV2254AID Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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