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TLV2262AIPW - Texas Instruments

Description: Operational Amplifiers - Op Amps Advanced LinCMOS Rail-To-Rail Dual

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PCB Footprints
TLV2262AIPW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW0008A 2021
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TLV2262AIPW - Texas Instruments  - 3D model - Small Outline Packages - PW0008A 2021
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TLV2262AIPW Details

  • Manufacturer Part Number:

    TLV2262AIPW

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0008 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    83 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    950 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.4 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Min:

    0.3 V/us

  • Slew Rate-Nom:

    0.55 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.5 mA

  • Supply Voltage Limit-Max:

    16 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    710

  • Voltage Gain-Min:

    30000

  • Wideband:

    NO

  • Width:

    3 mm

TLV2262AIPW Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a compact layout with the TLV2262AIPW placed close to the power supply pins, with short traces and minimal inductance to reduce noise and ensure stability. A 4-layer PCB with a solid ground plane is also recommended.
  • Ensure good thermal conduction by providing a thermal pad on the PCB, and consider using a heat sink or thermal interface material if the device will be operating in a high-temperature environment. Also, avoid overheating the device during soldering or rework.
  • The high output current capability of the TLV2262AIPW requires careful PCB design to ensure that the traces and vias can handle the current without overheating or experiencing voltage drops. Use wide traces, multiple vias, and consider using a copper pour to reduce resistance and inductance.
  • Use a low-ESR output capacitor, such as a ceramic or film capacitor, and place it close to the output pin. Also, consider adding a noise-reducing capacitor, such as a ferrite bead or a common-mode choke, in series with the output.
  • The low dropout voltage of the TLV2262AIPW allows for a smaller input-to-output voltage differential, which can simplify system design and reduce the need for voltage regulators with high input voltage ratings. However, it also means that the device may not be suitable for applications with very high input voltages.

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TLV2262AIPW Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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