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TLV2262IPWR - Texas Instruments

Description: Dual Rail-To-Rail Low-Voltage Low-Power Operational Amplifier

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TLV2262IPWR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW0008A
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TLV2262IPWR - Texas Instruments  - 3D model - Small Outline Packages - PW0008A
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TLV2262IPWR Details

  • Manufacturer Part Number:

    TLV2262IPWR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0008 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    83 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.4 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Min:

    0.3 V/us

  • Slew Rate-Nom:

    0.55 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.5 mA

  • Supply Voltage Limit-Max:

    16 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    710

  • Voltage Gain-Min:

    30000

  • Wideband:

    NO

  • Width:

    3 mm

TLV2262IPWR Frequently Asked Questions (FAQs)

  • A good PCB layout for the TLV2262IPWR involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To prevent overheating, ensure the TLV2262IPWR operates within its recommended operating conditions by keeping the junction temperature (TJ) below 150°C, using a heat sink if necessary, and providing adequate airflow. Also, ensure the device is not exposed to moisture or humidity.
  • Not using the recommended bypass capacitors on the TLV2262IPWR can lead to instability, oscillations, and reduced performance. The bypass capacitors help to filter out noise and ensure the device operates within its specified parameters.
  • The TLV2262IPWR can operate in high-temperature environments, but it's essential to take precautions to prevent overheating. Ensure good airflow, use a heat sink if necessary, and consider derating the device's power dissipation to prevent thermal shutdown.
  • To troubleshoot issues with the TLV2262IPWR, start by checking the PCB layout, ensuring proper decoupling and bypassing. Verify the input and output voltage levels, and check for noise or oscillations on the output. Also, ensure the device is operated within its recommended operating conditions.

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TLV2262IPWR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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