TLV2262MJGB - Texas Instruments

TLV2262MJGB Details

• Manufacturer Part Number:

  TLV2262MJGB

• Brand Name:

  Texas Instruments

• Pbfree Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  DIP

• Pin Count:

  8

• ECCN Code:

  EAR99

• HTS Code:

  8542.33.00.01

• Manufacturer:

  Texas Instruments

• YTEOL:

  15

• Amplifier Type:

  OPERATIONAL AMPLIFIER

• Architecture:

  VOLTAGE-FEEDBACK

• Average Bias Current-Max (IIB):

  0.0008 µA

• Bias Current-Max (IIB) @25C:

  0.00006 µA

• Common-mode Reject Ratio-Min:

  70 dB

• Common-mode Reject Ratio-Nom:

  83 dB

• Frequency Compensation:

  YES

• Input Offset Current-Max (IIO):

  0.00006 µA

• Input Offset Voltage-Max:

  2500 µV

• JESD-30 Code:

  R-GDIP-T8

• JESD-609 Code:

  e0

• Length:

  9.58 mm

• Low-Bias:

  YES

• Low-Offset:

  NO

• Micropower:

  YES

• Number of Functions:

  2

• Number of Terminals:

  8

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -55 °C

• Package Body Material:

  CERAMIC, GLASS-SEALED

• Package Code:

  DIP

• Package Equivalence Code:

  DIP8,.3

• Package Shape:

  RECTANGULAR

• Package Style:

  IN-LINE

• Packing Method:

  TUBE

• Power:

  NO

• Programmable Power:

  NO

• Qualification Status:

  Not Qualified

• Screening Level:

  MIL-STD-883

• Seated Height-Max:

  5.08 mm

• Slew Rate-Min:

  0.25 V/us

• Slew Rate-Nom:

  0.55 V/us

• Subcategory:

  Operational Amplifier

• Supply Current-Max:

  0.5 mA

• Supply Voltage Limit-Max:

  16 V

• Supply Voltage-Nom (Vsup):

  3 V

• Surface Mount:

  NO

• Technology:

  CMOS

• Temperature Grade:

  MILITARY

• Terminal Finish:

  Tin/Lead (Sn/Pb)

• Terminal Form:

  THROUGH-HOLE

• Terminal Pitch:

  2.54 mm

• Terminal Position:

  DUAL

• Unity Gain BW-Nom:

  710

• Voltage Gain-Min:

  25000

• Wideband:

  NO

• Width:

  7.62 mm