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TLV2352IPWR - Texas Instruments

Description: Dual Low Voltage LinCMOS™ Differential Comparator

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TLV2352IPWR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW (R-PDSO-G8)
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TLV2352IPWR - Texas Instruments  - 3D model - Small Outline Packages - PW (R-PDSO-G8)
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TLV2352IPWR Details

  • Manufacturer Part Number:

    TLV2352IPWR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.002 µA

  • Bias Current-Max (IIB) @25C:

    0.002 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    OPEN-COLLECTOR; OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Response Time-Nom:

    640 ns

  • Seated Height-Max:

    1.2 mm

  • Subcategory:

    Comparator

  • Supply Current-Max:

    0.3 mA

  • Supply Voltage Limit-Max:

    8 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

TLV2352IPWR Frequently Asked Questions (FAQs)

  • It is recommended to follow a star-grounding scheme, keep analog and digital grounds separate, and use a solid ground plane to minimize noise. Additionally, keep the input and output traces short and away from each other to reduce crosstalk.
  • Ensure good airflow around the device, avoid blocking airflow vents, and use a heat sink if necessary. Also, consider using thermal interface materials to improve heat transfer between the device and the heat sink.
  • Power up the device in the following sequence: VCC, then VIN, and finally the input signals. Ensure that the power supplies are stable and within the recommended voltage range before applying input signals.
  • Use an ESD wrist strap or mat, handle the device by the body or pins, avoid touching the pins or leads, and store the device in an anti-static bag or container when not in use.
  • Use a high-quality, low-loss PCB material such as FR4 or Rogers 4350B, with a thickness of 0.0625 inches (1.6 mm) or 0.093 inches (2.4 mm) for optimal performance and thermal management.

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TLV2352IPWR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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