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TLV2374IDG4 - Texas Instruments

Description: Operational Amplifiers - Op Amps 550-uA/Channel 3-MHz RRIO Op Amp

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TLV2374IDG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (-R-PDSO-G14)
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TLV2374IDG4 - Texas Instruments  - 3D model - Small Outline Packages - D (-R-PDSO-G14)
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TLV2374IDG4 Details

  • Manufacturer Part Number:

    TLV2374IDG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    14

  • Country Of Origin:

    Mainland China, Malaysia, Mexico, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00006 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    55 dB

  • Common-mode Reject Ratio-Nom:

    72 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    4500 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    1 V/us

  • Slew Rate-Nom:

    2.4 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    2.64 mA

  • Supply Voltage Limit-Max:

    16.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    79432

  • Wideband:

    YES

  • Width:

    3.9 mm

TLV2374IDG4 Frequently Asked Questions (FAQs)

  • The maximum power dissipation of TLV2374IDG4 is 670mW at 25°C free-air temperature, and it can be calculated using the formula: Pd = (VIN x IIN) + (VOUT x IOUT).
  • To minimize noise and ensure stability, it is recommended to follow good PCB layout practices such as separating analog and digital grounds, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, the input and output capacitors should be placed close to the device and connected to the correct pins.
  • The recommended input capacitor value is 1uF to 10uF, and the recommended output capacitor value is 1uF to 22uF. The capacitor type should be a low-ESR ceramic capacitor, such as X5R or X7R.
  • To ensure stability, the device requires a minimum output capacitance of 1uF, and the output capacitor should be connected to a low-impedance output. Additionally, the input voltage should be well-regulated and free of noise, and the device should be operated within its recommended operating conditions.
  • The maximum input voltage that can be applied to TLV2374IDG4 is 15V, and the device is not designed to operate with input voltages above this value.

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TLV2374IDG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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