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TLV2442CD - Texas Instruments

Description: Advanced LinCMOS™ rail-to-rail output wide-input-voltage dual operational amplifier

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TLV2442CD - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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TLV2442CD Details

  • Manufacturer Part Number:

    TLV2442CD

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mexico, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00006 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    2000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.65 V/us

  • Slew Rate-Nom:

    0.02 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.3 mA

  • Supply Voltage Limit-Max:

    12 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    52

  • Voltage Gain-Min:

    700

  • Wideband:

    NO

  • Width:

    3.9 mm

TLV2442CD Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a star-ground configuration, with the analog and digital grounds separated and connected at a single point. Additionally, keep the input and output traces short and away from digital signals, and use a solid ground plane to reduce noise.
  • Power up the device in the following sequence: VCC, VREF, and then VIN. Power down in the reverse sequence. Ensure that VREF is stable before applying VIN, and that VIN is removed before powering down VREF and VCC.
  • The TLV2442CD can drive up to 1nF of capacitive load. Exceeding this limit can cause oscillations or instability. To ensure stability, use a series resistor (Rs) to limit the capacitive load, and calculate Rs using the formula: Rs = 100Ω / (Cload / 1nF).
  • To optimize high-frequency performance, use a low-ESR capacitor (e.g., ceramic or film) for the bypass capacitor, and place it as close as possible to the device's power pins. Additionally, use a high-frequency-compatible layout, with short traces and minimal vias, and consider using a shielded enclosure to reduce electromagnetic interference.
  • The TLV2442CD has a maximum junction temperature (TJ) of 150°C. Ensure reliable operation by keeping the device's thermal pad connected to a solid ground plane, using a heat sink or thermal interface material if necessary, and avoiding high-temperature storage or operation above 85°C.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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