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TLV2444IPWR - Texas Instruments

Description: Advanced LinCMOS™ rail-to-rail output wide-input-voltage quad operational amplifier

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TLV2444IPWR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW
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TLV2444IPWR Details

  • Manufacturer Part Number:

    TLV2444IPWR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    14

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00006 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    75 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    2000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Min:

    0.65 V/us

  • Slew Rate-Nom:

    1.4 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    4.4 mA

  • Supply Voltage Limit-Max:

    12 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1810

  • Voltage Gain-Min:

    400

  • Wideband:

    NO

  • Width:

    4.4 mm

TLV2444IPWR Frequently Asked Questions (FAQs)

  • The maximum power dissipation of TLV2444IPWR is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (RθJA) of 125°C/W.
  • To minimize noise and ensure reliable operation, it is recommended to follow good PCB layout practices such as separating analog and digital grounds, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, the datasheet provides a recommended PCB layout and thermal pad connection.
  • The recommended operating voltage range for TLV2444IPWR is 2.7V to 16V, although the device can operate up to 18V with reduced performance. Operating the device outside of the recommended range may affect its reliability and performance.
  • The thermal pad on the TLV2444IPWR should be connected to a solid ground plane on the PCB to ensure good thermal conduction. The thermal pad should not be connected to a voltage potential or left floating, as this can cause the device to malfunction or fail.
  • The input impedance of TLV2444IPWR is typically around 10MΩ, although this can vary depending on the specific application and operating conditions. The datasheet provides more detailed information on input impedance and how it affects the device's performance.

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TLV2444IPWR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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