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TLV2451IDBVT - Texas Instruments

Description: Texas Instruments TLV2451IDBVT Op Amp, 0.22MHz Rail-Rail, 3 V, 5 V, 5-Pin SOT-23

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PCB Footprints
TLV2451IDBVT - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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3D Models
TLV2451IDBVT - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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TLV2451IDBVT Details

  • Manufacturer Part Number:

    TLV2451IDBVT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • Country Of Origin:

    Mainland China, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.007 µA

  • Bias Current-Max (IIB) @25C:

    0.005 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00045 µA

  • Input Offset Voltage-Max:

    1500 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Min:

    0.02 V/us

  • Slew Rate-Nom:

    0.11 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.042 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn); Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    220

  • Voltage Gain-Min:

    63095

  • Wideband:

    NO

  • Width:

    1.6 mm

TLV2451IDBVT Frequently Asked Questions (FAQs)

  • It is recommended to follow a star-grounding scheme, keep analog and digital grounds separate, and use a solid ground plane to minimize noise. Additionally, keep the input and output traces short and away from each other to reduce crosstalk.
  • It is recommended to power up the device in the following sequence: VCC, then VIN, and then the input signals. During power-down, reverse the sequence. Ensure that the input signals are stable and within the recommended voltage range before applying power to the device.
  • For single-ended inputs, a 50-ohm termination resistor is recommended. For differential inputs, a 100-ohm differential termination resistor is recommended. For outputs, a 50-ohm back-termination resistor is recommended to minimize reflections and ensure signal integrity.
  • Ensure good airflow around the device, and consider using a heat sink or thermal pad to dissipate heat. Keep the device away from other heat sources, and avoid blocking airflow to the device. Monitor the device temperature and adjust the thermal management strategy accordingly.
  • Use a high-quality, low-loss PCB material such as FR4 or Rogers 4350B. A 4-layer stack-up with a solid ground plane and a separate power plane is recommended. Keep the signal layers away from the power plane and use a consistent impedance throughout the board.

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TLV2451IDBVT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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