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TLV2461AIP - Texas Instruments

Description: Single, Low Power, Rail-to-Rail Input/Output Operational Amplifier

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TLV2461AIP - Texas Instruments PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - P (R-PDIP-T8)
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TLV2461AIP - Texas Instruments  - 3D model - Dual-In-Line Packages - P (R-PDIP-T8)
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TLV2461AIP Details

  • Manufacturer Part Number:

    TLV2461AIP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.075 µA

  • Bias Current-Max (IIB) @25C:

    0.014 µA

  • Common-mode Reject Ratio-Min:

    66 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.007 µA

  • Input Offset Voltage-Max:

    1500 µV

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e4

  • Length:

    9.59 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.08 mm

  • Slew Rate-Min:

    0.8 V/us

  • Slew Rate-Nom:

    1.6 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.9 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    6400

  • Voltage Gain-Min:

    31622

  • Wideband:

    NO

  • Width:

    7.62 mm

TLV2461AIP Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a star-ground layout, with the TLV2461AIP placed close to the analog signal sources, and the analog and digital grounds separated to minimize noise coupling. Additionally, it's recommended to place a 0.1uF decoupling capacitor between the VCC and GND pins, and a 10uF capacitor between the VCC and AVCC pins.
  • The TLV2461AIP is specified to operate from -40°C to 125°C. To ensure operation within this range, engineers should consider the thermal design of their system, including heat sinking, airflow, and thermal interface materials. Additionally, they should monitor the device's junction temperature using the thermal pad or an external temperature sensor.
  • The recommended input impedance for the TLV2461AIP is 1kΩ or higher. This is to ensure that the input signal is not attenuated and to minimize the effects of input bias current. Engineers should also consider the input impedance of the signal source and the cable capacitance when designing their system.
  • The TLV2461AIP has built-in ESD protection, but engineers should still take precautions to prevent ESD damage during handling and assembly. This includes using ESD-safe workstations, wrist straps, and packaging materials, as well as following proper handling and storage procedures.
  • Texas Instruments recommends a power-up sequence where the digital supply (VCC) is powered up before the analog supply (AVCC). This ensures that the digital circuitry is fully powered up before the analog circuitry, which helps to prevent unwanted analog signal transients.

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TLV2461AIP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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