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TLV2462IP - Texas Instruments

Description: Dual Low-Power, Rail-to-Rail Input/Output Operational Amplifier

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TLV2462IP - Texas Instruments PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - p(r-pdip-t8
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TLV2462IP Details

  • Manufacturer Part Number:

    TLV2462IP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China, Mexico, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.075 µA

  • Bias Current-Max (IIB) @25C:

    0.014 µA

  • Common-mode Reject Ratio-Min:

    71 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.007 µA

  • Input Offset Voltage-Max:

    2000 µV

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e4

  • Length:

    9.59 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Packing Method:

    TUBE

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.08 mm

  • Slew Rate-Min:

    0.8 V/us

  • Slew Rate-Nom:

    1.6 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    1.3 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    6400

  • Voltage Gain-Min:

    31622

  • Wideband:

    NO

  • Width:

    7.62 mm

TLV2462IP Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TLV2462IP is dependent on the package type and ambient temperature. For the PDIP package, the maximum power dissipation is 670mW at 25°C. For the SOIC package, it is 450mW at 25°C. Refer to the thermal characteristics table in the datasheet for more information.
  • To ensure stability in a unity-gain buffer configuration, make sure to use a low-ESR capacitor (e.g., ceramic or film capacitor) with a value between 10nF to 100nF between the output and the inverting input. This capacitor helps to compensate for the op-amp's internal capacitance and ensures stability.
  • To minimize noise and EMI, follow these layout and routing guidelines: keep the input and output traces short and away from each other, use a ground plane, and place decoupling capacitors (e.g., 0.1uF ceramic capacitors) close to the power pins. Avoid running high-frequency signals near the op-amp's inputs and outputs.
  • While the TLV2462IP can be used as a comparator, it is not recommended due to its relatively slow slew rate (0.5V/us) and limited output current drive capability. Texas Instruments recommends using a dedicated comparator, such as the TLV7031, for comparator applications.
  • The input bias current and input offset voltage of the TLV2462IP can be calculated using the formulas provided in the datasheet. The input bias current is typically around 1pA, and the input offset voltage is typically around 0.5mV. However, these values can vary depending on the specific device and operating conditions.

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TLV2462IP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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