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TLV2464AIDG4 - Texas Instruments

Description: Operational Amplifiers - Op Amps Quad Low Power Rail-to-Rail I/O

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TLV2464AIDG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (-R-PDSO-G14)_1
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TLV2464AIDG4 - Texas Instruments  - 3D model - Small Outline Packages - D (-R-PDSO-G14)_1
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TLV2464AIDG4 Details

  • Manufacturer Part Number:

    TLV2464AIDG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    14

  • Country Of Origin:

    Mexico, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.075 µA

  • Bias Current-Max (IIB) @25C:

    0.014 µA

  • Common-mode Reject Ratio-Min:

    71 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.007 µA

  • Input Offset Voltage-Max:

    1500 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.8 V/us

  • Slew Rate-Nom:

    1.6 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    2.6 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    6400

  • Voltage Gain-Min:

    31622

  • Wideband:

    NO

  • Width:

    3.9 mm

TLV2464AIDG4 Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TLV2464AIDG4 is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • Yes, the TLV2464AIDG4 can be used as a unity gain buffer. It has a high input impedance and a low output impedance, making it suitable for buffering applications. However, ensure that the output current requirements do not exceed the maximum output current of 40mA.
  • To minimize noise and ensure good performance, follow good PCB layout practices such as separating analog and digital grounds, using a solid ground plane, and keeping noise-sensitive traces away from high-current traces. Additionally, place decoupling capacitors close to the op-amp's power pins and use a low-ESR capacitor for the bypass capacitor.
  • The recommended capacitor value for the bypass capacitor (CBYP) is 0.1μF to 10μF, with a low-ESR ceramic capacitor being a good choice. The exact value depends on the specific application and noise requirements.
  • The TLV2464AIDG4 is rated for operation up to 125°C, but its performance may degrade at high temperatures. Ensure that the device is operated within its specified temperature range and that the maximum junction temperature (TJ) is not exceeded.

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TLV2464AIDG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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