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TLV2464IPWR - Texas Instruments

Description: Quad Low Power, Rail-to-Rail Input/Output Operational Amplifier

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TLV2464IPWR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW (R-PDSO-G14)
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TLV2464IPWR - Texas Instruments  - 3D model - Small Outline Packages - PW (R-PDSO-G14)
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TLV2464IPWR Details

  • Manufacturer Part Number:

    TLV2464IPWR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    14

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.075 µA

  • Bias Current-Max (IIB) @25C:

    0.014 µA

  • Common-mode Reject Ratio-Min:

    71 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.007 µA

  • Input Offset Voltage-Max:

    2000 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Min:

    0.8 V/us

  • Slew Rate-Nom:

    1.6 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    2.6 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    6400

  • Voltage Gain-Min:

    31622

  • Wideband:

    NO

  • Width:

    4.4 mm

TLV2464IPWR Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the TLV2464IPWR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing the decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • The TLV2464IPWR has a thermal pad that must be connected to a thermal relief pattern on the PCB to ensure proper heat dissipation. A thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink.
  • The recommended input capacitance is 10nF to 100nF, and the recommended output capacitance is 10nF to 100nF. However, the optimal capacitance values may vary depending on the specific application and operating conditions.
  • To ensure EMC, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the input and output lines. Additionally, follow proper PCB layout and grounding practices.
  • The TLV2464IPWR has an operating temperature range of -40°C to 125°C. However, the device's performance and reliability may degrade at extreme temperatures, so it's essential to ensure proper thermal management and heat dissipation.

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TLV2464IPWR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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