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TLV2470IDBVT - Texas Instruments

Description: Precision Amplifiers Sngl Lo-Pwr R-to-R I/O Op Amp w/Shutdwn

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PCB Footprints
TLV2470IDBVT - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV (R-PDSO-G6)
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3D Models
TLV2470IDBVT - Texas Instruments  - 3D model - SOT23 (6-Pin) - DBV (R-PDSO-G6)
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TLV2470IDBVT Details

  • Manufacturer Part Number:

    TLV2470IDBVT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    6

  • Country Of Origin:

    Mainland China, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0003 µA

  • Bias Current-Max (IIB) @25C:

    0.00005 µA

  • Common-mode Reject Ratio-Min:

    64 dB

  • Common-mode Reject Ratio-Nom:

    84 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00005 µA

  • Input Offset Voltage-Max:

    2200 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Min:

    0.6 V/us

  • Slew Rate-Nom:

    1.5 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.9 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2800

  • Voltage Gain-Min:

    25000

  • Wideband:

    NO

  • Width:

    1.6 mm

TLV2470IDBVT Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TLV2470IDBVT is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To minimize noise and ensure optimal performance, it is recommended to follow good PCB layout practices, such as separating analog and digital grounds, using a solid ground plane, and keeping the input and output traces short and away from noise sources.
  • The recommended capacitor value for decoupling the power supply is 0.1uF to 1uF, depending on the specific application and noise requirements. A larger capacitor value can help to further reduce noise and ripple on the power supply lines.
  • While the TLV2470IDBVT is an op-amp, it can be used as a comparator in certain applications. However, it is not recommended for high-speed or high-frequency comparator applications due to its limited slew rate and bandwidth.
  • To handle ESD protection when handling the TLV2470IDBVT, it is recommended to follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging.

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TLV2470IDBVT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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