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TLV2632IDR - Texas Instruments

Description: FEATURES  Rail-To-Rail Output  VICR Includes Ground  Gain-Bandwidth Product ... 9 MHz  Supply Current ... 730 µA/Channel  Single, Duals, and Quad Versions  Ultralow Power Down Mode IDD(SHDN) = 4 µA/Channel  Specified Temperature Range −40°C to 125°C ... Industrial Grade  Supply Voltage Range ... 2.7 V to 5.5 V  Ultrasmall Packaging 5 or 6 Pin SOT-23 (TLV2630/1) 8 or 10 Pin MSOP (TLV2632/3)  Universal Op-Amp EVM (See SLOU060 for More Information)

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TLV2632IDR - Texas Instruments - PCB symbol
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TLV2632IDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G8)
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TLV2632IDR - Texas Instruments - 3D model - Small Outline Packages - D (R-PDSO-G8)
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TLV2632IDR Details

  • Manufacturer Part Number:

    TLV2632IDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Bias Current-Max (IIB) @25C:

    0.000005 µA

  • Common-mode Reject Ratio-Min:

    77 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00005 µA

  • Input Offset Voltage-Max:

    3500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    6 V/us

  • Slew Rate-Nom:

    6 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    2 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    9000

  • Voltage Gain-Min:

    31622

  • Wideband:

    NO

  • Width:

    3.9 mm

TLV2632IDR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a star-ground connection for the analog and digital grounds, and to keep the analog and digital signal traces separate to minimize noise coupling. Additionally, it's recommended to use a solid ground plane and to avoid routing digital signals under the device.
  • The TLV2632IDR requires a specific power-up sequence to prevent damage or incorrect operation. The recommended sequence is to power up the VCC pin first, followed by the VREF pin, and then the analog input signals. This ensures that the internal biasing and reference circuits are properly established before the analog inputs are applied.
  • The TLV2632IDR can drive a maximum capacitive load of 100 pF. Exceeding this limit can affect the output settling time and may cause oscillations. It's recommended to use a buffer capacitor of 10-22 pF to improve the output settling time and reduce ringing.
  • The TLV2632IDR is specified to operate within a temperature range of -40°C to 125°C. Exceeding this range can affect the device's accuracy, linearity, and reliability. It's recommended to use thermal management techniques such as heat sinks or thermal interfaces to keep the device within its specified temperature range.
  • Texas Instruments recommends using a reflow soldering process with a peak temperature of 260°C for the TLV2632IDR. Improper soldering techniques, such as excessive temperature or prolonged exposure to heat, can damage the device or affect its reliability.

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TLV2632IDR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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