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TLV271SN1T1G - onsemi

Description: Rail To Rail Output; Wide Bandwidth: 3 MHz; Wide Power Supply Range: 2.7 V to 16 V; Low Supply Current: 550 µA; Low Input Bias Current: 1 pA; Wide Temperature Range: -40°C to +105°C

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PCB Footprints
TLV271SN1T1G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP-5 CASE 483-02-1
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TLV271SN1T1G - onsemi  - 3D model - SOT23 (5-Pin) - TSOP-5 CASE 483-02-1
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TLV271SN1T1G Details

  • Manufacturer Part Number:

    TLV271SN1T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    483

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    onsemi

  • YTEOL:

    5.15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00015 µA

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    7000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -8.25 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TAPE AND REEL

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Min:

    1 V/us

  • Slew Rate-Nom:

    2.6 V/us

  • Supply Current-Max:

    1 mA

  • Supply Voltage Limit-Max:

    8.25 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    6300

  • Wideband:

    NO

  • Width:

    1.5 mm

TLV271SN1T1G Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the TLV271SN1T1G is 670 mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (RθJA) of 125°C/W.
  • To ensure stability, it's essential to follow proper layout and decoupling techniques, such as using a 0.1 μF capacitor between the power supply pins and ground, and minimizing the distance between the op-amp and the bypass capacitors.
  • The recommended operating voltage range for the TLV271SN1T1G is 2.7 V to 5.5 V, although the device can operate down to 2.5 V with reduced performance.
  • The TLV271SN1T1G has built-in ESD protection, but it's still essential to follow proper handling and storage procedures to prevent damage. Use an anti-static wrist strap or mat, and store the devices in anti-static packaging.
  • The maximum input voltage range for the TLV271SN1T1G is from -0.3 V to VCC + 0.3 V, where VCC is the positive supply voltage.

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