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TLV2721IDBVT - Texas Instruments

Description: Operational Amplifiers - Op Amps Single LinCMOS R-To-R Very Lo-Power

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PCB Footprints
TLV2721IDBVT - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV (R-PDSO-G5) *
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3D Models
TLV2721IDBVT - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV (R-PDSO-G5) *
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TLV2721IDBVT Details

  • Manufacturer Part Number:

    TLV2721IDBVT

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00015 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Min:

    0.05 V/us

  • Slew Rate-Nom:

    0.25 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.15 mA

  • Supply Voltage Limit-Max:

    12 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    510

  • Voltage Gain-Min:

    1000

  • Wideband:

    NO

  • Width:

    1.6 mm

TLV2721IDBVT Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a compact layout with the device placed close to the power supply pins, and the input and output pins separated to minimize noise coupling. A ground plane is also recommended to reduce noise and improve thermal performance.
  • To ensure stability, ensure that the output capacitor is properly sized and placed close to the output pin, and that the input and output resistors are properly matched. Additionally, avoid using long traces and minimize parasitic inductance and capacitance in the circuit.
  • The maximum power dissipation of the TLV2721IDBVT is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature, but this can be derated to 0.7W at 85°C ambient temperature.
  • Yes, the TLV2721IDBVT is rated for operation up to 125°C junction temperature, but the maximum power dissipation must be derated accordingly. Additionally, the device's performance and accuracy may degrade at high temperatures, so careful consideration should be given to the application's requirements.
  • The TLV2721IDBVT has built-in ESD protection, but additional protection measures such as TVS diodes or zener diodes can be used to protect the device from overvoltage events. Additionally, proper PCB design and layout practices, such as using guard rings and minimizing trace lengths, can help to reduce the risk of ESD damage.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Operational Amplifier, 1 Func, 3000uV Offset-Max, CMOS, PDSO5