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TLV272CDGKRG4 - Texas Instruments

Description: Operational Amplifiers - Op Amps 550-uA/Ch 3-MHz Rail-to-Rail Out

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TLV272CDGKRG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV272CDGKRG4 - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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TLV272CDGKRG4 Details

  • Manufacturer Part Number:

    TLV272CDGKRG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP

  • Package Description:

    VSSOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00006 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    69 dB

  • Common-mode Reject Ratio-Nom:

    85 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    7000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -8 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Min:

    1 V/us

  • Slew Rate-Nom:

    2.6 V/us

  • Supply Current-Max:

    2 mA

  • Supply Voltage Limit-Max:

    8 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    76000

  • Wideband:

    NO

  • Width:

    3 mm

TLV272CDGKRG4 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a compact layout with short traces, and placing the device close to the power supply bypass capacitors to minimize noise and ensure stability. A 4-layer PCB with a solid ground plane is also recommended.
  • The TLV272CDGKRG4 has a thermal pad on the bottom of the package, which should be connected to a thermal plane or a heat sink to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer.
  • Texas Instruments recommends using ceramic capacitors with a value of 10nF to 100nF for input and output bypassing. The capacitors should be placed as close as possible to the device pins.
  • To ensure stability, the TLV272CDGKRG4 requires a minimum load capacitance of 10nF, and the output should not be left open-circuit. Additionally, the device should be decoupled from the power supply using a 10uF to 100uF capacitor.
  • The TLV272CDGKRG4 has an operating temperature range of -40°C to 125°C. However, the device's performance may degrade at higher temperatures, and the output voltage may drop.

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TLV272CDGKRG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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