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TLV2731CDBVR - Texas Instruments

Description: Single LinCMOS™ Rail-To-Rail Low-Power Operational Amplifier

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TLV2731CDBVR - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV (R-PDSO-G5)_2021
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TLV2731CDBVR - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV (R-PDSO-G5)_2021
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TLV2731CDBVR Details

  • Manufacturer Part Number:

    TLV2731CDBVR

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00015 µA

  • Bias Current-Max (IIB) @25C:

    0.00006 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    70 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00006 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Min:

    0.5 V/us

  • Slew Rate-Nom:

    1.6 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    1.3 mA

  • Supply Voltage Limit-Max:

    12 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Unity Gain BW-Nom:

    2000

  • Voltage Gain-Min:

    300

  • Wideband:

    NO

  • Width:

    1.65 mm

TLV2731CDBVR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a star-ground connection for the device, with the GND pin connected to a solid ground plane. Additionally, keep the input and output traces short and away from noise sources, and use a 0.1uF decoupling capacitor between the VCC and GND pins.
  • When the input voltage is close to the rail-to-rail output voltage range, the output voltage swing may be limited. To handle this, consider adding a voltage follower or a buffer stage to the output, or use an amplifier with a higher output voltage swing.
  • The TLV2731CDBVR can drive up to 100pF of capacitive load. However, it's recommended to limit the capacitive load to 50pF or less to ensure stability and optimal performance.
  • Ensure that the device is operated within its specified temperature range of -40°C to 125°C. Use thermal management techniques such as heat sinks, thermal pads, or thermal interfaces to keep the device temperature within the specified range.
  • The recommended input impedance for the TLV2731CDBVR is 1kΩ or higher. Lower input impedance can lead to reduced input signal amplitude and increased noise sensitivity.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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