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TLV2761IDBVT - Texas Instruments

Description: Texas Instruments TLV2761IDBVT Op Amp, 0.5MHz CMOS, Rail to Rail, 3 V, 5-Pin SOT-23

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TLV2761IDBVT - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TLV2761IDBVT
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TLV2761IDBVT - Texas Instruments  - 3D model - SOT23 (5-Pin) - TLV2761IDBVT
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TLV2761IDBVT Details

  • Manufacturer Part Number:

    TLV2761IDBVT

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Bias Current-Max (IIB) @25C:

    0.000015 µA

  • Common-mode Reject Ratio-Min:

    55 dB

  • Common-mode Reject Ratio-Nom:

    76 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.000015 µA

  • Input Offset Voltage-Max:

    3500 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Min:

    0.07 V/us

  • Slew Rate-Nom:

    0.22 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.028 mA

  • Supply Voltage Limit-Max:

    4 V

  • Supply Voltage-Nom (Vsup):

    2.4 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    500

  • Voltage Gain-Min:

    18000

  • Wideband:

    NO

  • Width:

    1.6 mm

TLV2761IDBVT Frequently Asked Questions (FAQs)

  • The TLV2761IDBVT is a high-frequency device, so it's essential to follow good PCB layout practices to minimize noise and ensure signal integrity. Place the device close to the power supply, use a solid ground plane, and keep the input and output traces short and separate.
  • The TLV2761IDBVT requires a specific power-up and power-down sequencing to prevent latch-up and ensure proper operation. Power up the device in the following order: VCC, VIN, and then the input signal. Power down in the reverse order.
  • The TLV2761IDBVT can drive a maximum capacitive load of 100 pF. Exceeding this limit may cause oscillations or instability in the output signal.
  • Use a low-pass filter with a cut-off frequency above the desired signal bandwidth to filter out noise and ripple in the output signal. A simple RC filter or a more complex active filter can be used, depending on the specific application requirements.
  • The thermal impedance of the DBV package is typically around 30°C/W. This value can be used to estimate the junction temperature of the device under different operating conditions.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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