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TLV2764IDR - Texas Instruments

Description: Quad 1.8-V, Micro-power, Rail-to-Rail, Single Supply Amplifier

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TLV2764IDR - Texas Instruments - PCB symbol
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PCB Footprints
TLV2764IDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D(R-DPSO-G14)
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TLV2764IDR - Texas Instruments - 3D model - Small Outline Packages - D(R-DPSO-G14)
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TLV2764IDR Details

  • Manufacturer Part Number:

    TLV2764IDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    14

  • Country Of Origin:

    Malaysia, Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Bias Current-Max (IIB) @25C:

    0.000015 µA

  • Common-mode Reject Ratio-Min:

    55 dB

  • Common-mode Reject Ratio-Nom:

    76 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.000015 µA

  • Input Offset Voltage-Max:

    3500 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.07 V/us

  • Slew Rate-Nom:

    0.22 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.112 mA

  • Supply Voltage Limit-Max:

    4 V

  • Supply Voltage-Nom (Vsup):

    2.4 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    500

  • Voltage Gain-Min:

    18000

  • Wideband:

    NO

  • Width:

    3.9 mm

TLV2764IDR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a star-ground connection for the analog and digital grounds, and placing the device close to the analog signal sources to minimize noise. Additionally, it's recommended to use a solid ground plane and to avoid running digital signals near the analog inputs.
  • The TLV2764IDR has a built-in POR and BOR circuitry, but it's recommended to add external circuitry to ensure a clean power-up sequence. This can include adding a voltage supervisor or a reset IC to ensure a reliable reset signal.
  • The recommended input impedance for the analog inputs is 1 kΩ or higher to ensure accurate voltage measurements. Lower input impedances can lead to measurement errors and increased noise sensitivity.
  • To minimize noise and interference, use a solid ground plane, keep analog and digital signals separate, and use shielding or guard rings around the analog inputs. Additionally, consider using a low-pass filter or a ferrite bead to filter out high-frequency noise.
  • The TLV2764IDR is rated for operation from -40°C to 125°C, but it's recommended to derate the device for extended operation at high temperatures. Consult the datasheet for specific derating guidelines.

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TLV2764IDR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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