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TLV2781CDBVR - Texas Instruments

Description: Operational Amplifiers - Op Amps Single 1.8V RRIO 8MHz Amplifier

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TLV2781CDBVR - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A_
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TLV2781CDBVR - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A_
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TLV2781CDBVR Details

  • Manufacturer Part Number:

    TLV2781CDBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0001 µA

  • Bias Current-Max (IIB) @25C:

    0.000015 µA

  • Common-mode Reject Ratio-Min:

    55 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.000015 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Min:

    1.89 V/us

  • Slew Rate-Nom:

    5 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.77 mA

  • Supply Voltage Limit-Max:

    4 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    8000

  • Voltage Gain-Min:

    50000

  • Wideband:

    NO

  • Width:

    1.6 mm

TLV2781CDBVR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout with a star-ground configuration, where the GND pin is connected to a solid ground plane. Additionally, keep the input and output traces short and away from each other to minimize noise coupling. Place the device close to the power supply and use a 0.1uF decoupling capacitor between VCC and GND.
  • The thermal shutdown feature is designed to protect the device from overheating. If the device exceeds the thermal shutdown temperature (typically 150°C), it will shut down. To handle this, ensure good thermal design, use a heat sink if necessary, and monitor the device temperature. If a shutdown occurs, allow the device to cool before restarting.
  • The recommended input voltage range for the TLV2781CDBVR is 2.7V to 5.5V. The output voltage is regulated to 2.8V ±2% for a 2.7V to 5.5V input range. If the input voltage falls below 2.7V, the output voltage may drop below 2.8V.
  • The output voltage tolerance is specified as ±2% of the nominal output voltage (2.8V). To calculate the tolerance, multiply the nominal output voltage by the tolerance percentage (e.g., 2.8V x 0.02 = 0.056V). The output voltage can vary by ±0.056V from the nominal value.
  • The maximum output current capability of the TLV2781CDBVR is 150mA. Exceeding this limit can cause the device to overheat, reduce its output voltage, or even shut down. Ensure that the output current is within the specified limit to maintain optimal performance.

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TLV2781CDBVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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